Hyde Analysis & Design

HVAC Analysis of a Shipping Container

By simulating the airflow patterns, we were able to assess how effectively the shipping container's ventilation system managed the heat generated by the transformer, ensuring optimal thermal conditions and safety.

Electric Field Analysis

A parameterized numerical study was conducted using COMSOL to simulate the electric field distribution between two parallel plates with varying distances and conditions. The analysis aimed to characterize the impact of different plate spacings on the electric field strength and its variation across the gap.

Structural and Thermal Analysis of Disc Brake

The analysis characterized the mechanical deformation, stress concentration, and friction-induced heat dissipation responses under simulated braking conditions. Effects of design choices on performance, durability and thermal management of model, informing design decisions for improved safety and efficiency observed.

Transport & Absorption Analysis

A COMSOL analysis conducted to analyze blood transport and absorption in a health pad made from an innovative absorbent polymer material. By simulating capillary action, diffusion, and convection in a detailed 3D model, the study was successful on optimizing the pad's design for absorption efficiency and improved performance in medical applications.

Sloshing Tank Analysis with PID Control

A sloshing tank in zero-gravity conditions, modeling the complex fluid motion within as it responds to microgravity. Additionally, the study couples this COMSOL analysis with PID control system design using Simulink, developing a controller that regulates the tank's liquid level by iterating flow rates and pressures in response to changes in the tank's dynamics in space.

Capacitance Analysis of a Flexible Transistor

By designing a parameterized 3D model and utilizing COMSOL to simulate, the goal was to analyze the transistor's electrical properties to elevate its capacitance behavior. The analysis successfully achieved the goal, leading to optimized design and enhanced performance in flexible electronic applications.

Performing computational fluid dynamic simulations for complex systems.

Analysis and design processes for parts to manage thermals and structural integrity.

Minimizing computational errors for real life endurance.

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